Active
RoHS Compliant

CYW43012

board
software
Multiple OPNs available
ea.

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CYW43012
CYW43012
ea.

Product details

  • Antenna Configuration
    1x1
  • Bluetooth Interface
    UART/PCM
  • Bluetooth Specification
    Bluetooth 5.4
  • Core
    Cortex M4
  • CPU
    N/A
  • Dimensions
    9 × 9 mm, 3.76 × 4.43 mm, 3.76 × 4.43 mm
  • Family
    AIROC™ Wi-Fi + Bluetooth® Combos
  • GPIOs
    16, 7, 16
  • Launch Date
    N/A
  • Longevity - 15 years
    No
  • Longevity - Extended
    No
  • Memory
    N/A
  • Operating system support
    Linux, Android, RTOS
  • Operating Temperature
    -20 °C to 70 °C
  • Operating Voltage
    3.2 V to 4.6 V
  • Package
    WLCSP-251, WLBGA-106, FCFBGA-300
  • Partner Module
    Y
  • Pitch
    0.4 mm, 0.2 mm, 0.35 mm
  • Planned to be available until at least
    N/A
  • Product Description
    Ultra-low power Wi-Fi 4
  • Replacement
    CYW43022
  • ROM
    1152 KB
  • Software Support
    ModusToolbox™
  • SRAM
    388 kByte
  • Wi-Fi Band
    2.4GHz, 5GHz
  • Wi-Fi Bandwidth
    20 MHz
  • WI-FI Interface
    SDIO/SPI
  • Wi-Fi Specification
    Wi-Fi 4 (802.11n)
Recommended
OPN
CYW43012C0WKWBGT CYW43012TC0KFFBH CYW43012TC0EKUBGT
Product Status active active active
Infineon Package SG-XFWLB-251 PG-TF2BGA-300
SG-XFWLB-106
Package Name WLCSP-251 (002-19495) FCFBGA-300 (001-19471) WLBGA-106 (002-19474)
Packing Size 5000 1300 5000
Packing Type TAPE & REEL TRAY TAPE & REEL
Moisture Level 1 3 1
Moisture Packing NON DRY DRY NON DRY
Lead-free No No Yes
Halogen Free Yes Yes Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package SG-XFWLB-251
Package Name WLCSP-251 (002-19495)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package PG-TF2BGA-300
Package Name FCFBGA-300 (001-19471)
Packing Size 1300
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status
Active
Infineon Package
SG-XFWLB-106
Package Name WLBGA-106 (002-19474)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon’s AIROC™ CYW43012 an ultra-low power single-chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.4. The CYW43012 is ideal for battery powered applications where power consumption is critical. On-chip power amplifier and low-noise amplifiers are included for both the 2.4 and 5GHz bands.

Features

  • Wi-Fi 5 Dual-band (2.4/5 GHz)
  • 1x1 SISO
  • Up to 78Mbps PHY data rate
  • Internal PA and LNA for both bands
  • Class 1 (100m) & Class 2 (10m) operation
  • BDR (1Mbps), EDR (2/3Mbps), LE (1/2Mbps)
  • PCM for audio data
  • Declaration ID D066227
  • QDID 229700
  • SDIO v2.0/v3.0 for WiFi, UART/SPI for BT
  • RTOS and Linux/Android support
  • 40 GPIOs

Benefits

  • Best-in-class power efficiency
  • Bluetooth® version 5.4 compliant

Documents

Documents

Design resources

Partner solutions

Developer community

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