WLBGA-106 (002-19474)

SG-XFWLB-106-800

Package details

  • Package Material
    SG
  • Package Family
    SG-XFWLB
  • Terminals
    106
  • Variant
    800
  • Exposed Paddle
    No
  • Body Length (mm)
    3.759
  • Body Width (mm)
    4.42
  • Min. Terminal Pitch (mm)
    0.35
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    5000
    1
Infineon wafer level ball grid array packages (WLB) are offered as various families. They are available as very thin (V), very very thin (W), ultra thin (U), and extemely thin (X) versions. Alternative and legacy designations are embedded WLB (eWLB), wafer level chip scale package (WLCSP) or wafer level ball grid array (WLBGA) package. The embedded WLB feature a minimum plastic mold body that can be rectangular or square. They are chip scale packages with fan-in/fan-out redistribution layer that marginally extends over the silicon die. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). Typical products are radar sensors, micro controllers, magnetic sensors, and more.

Image Gallery

SG-XFWLB-106-800_Tape and Reel
SG-XFWLB-106-800_Tape and Reel
SG-XFWLB-106-800_Tape and Reel SG-XFWLB-106-800_Tape and Reel SG-XFWLB-106-800_Tape and Reel
SG-XFWLB-106-800_Footprint Drawing SG-XFWLB-106-800_Footprint Drawing SG-XFWLB-106-800_Footprint Drawing
SG-XFWLB-106-800_Package Outline SG-XFWLB-106-800_Package Outline SG-XFWLB-106-800_Package Outline
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Documents and drawings

Documents and drawings