Active and preferred
RoHS Compliant
Lead-free

CYT3DLABHBQ1AESGS

Data Sheet
package
board
ea.
in stock

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CYT3DLABHBQ1AESGS
CYT3DLABHBQ1AESGS
ea.
Data Sheet

Product details

  • 16bit TCPWM (Motor control)
    0
  • 16bit TCPWM
    50
  • 32bit TCPWM
    32
  • ADC Channel
    48
  • ASIL/SIL support
    ASIL-B
  • CAN-FD
    4
  • Classification
    ISO 26262-compliant
  • CXPI
    2
  • Cybersecurity Classification
    ISO 21434-compliant
  • Debug Interface
    SWD/JTAG/Trace
  • DMA Channels
    76/84/8
  • eMMC IO speed
    NA
  • eMMC
    0
  • eSHE/HSM
    HSM
  • Ethernet Ports
    1
  • Ethernet speed
    10/100
  • External Interrupt channel
    108
  • Family
    TRAVEO™ T2G CYT3DL Series
  • Flash Security
    Yes
  • Flash
    4160 kByte
  • Floating Point Unit
    Double precision
  • GPIO
    108
  • Graphics
    Yes
  • I2S
    2
  • JPEG Decoder
    0
  • LCD Direct Drive
    NA
  • LIN
    2
  • LPDDR4/DDR3 PHY
    NA
  • LVDS TX PHY
    1 x single
  • Main Core frequency
    240 MHz
  • Main Core type/Crypto Core type
    ARM_CM7F/CM0+
  • MIPI D-PHY
    1
  • MPU
    Yes
  • Operating temperature range TA
    -40°C to 105°C
  • PPU
    Yes
  • RC-OSC
    Yes
  • RTC channel
    1
  • SCB Blocks
    12
  • Smart IOs
    8
  • SMIF (SPI/HyperBus)
    2
  • SMIF speed
    100MHz
  • Software Bundle
    No
  • SRAM
    384 kByte
  • Supply Voltage
    2.7 to 5.5
  • Temperature sensor
    Y
  • Video-In
    1
  • Video-out
    2
  • VRAM Protection
    Yes
  • VRAM
    2 MB
  • Watchdog
    Yes
  • Work Flash
    128 kByte
Recommended
OPN
CYT3DLABHBQ1AESGS
Product Status active and preferred
Infineon Package
PG-TQFP-216
Package Name TEQFP-216 (002-30407)
Packing Size 400
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TQFP-216
Package Name TEQFP-216 (002-30407)
Packing Size 400
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CYT3DLABHBQ1AESGS belongs to the TRAVEO™ T2G CYT3DL family of microcontrollers. It is based on the highly-efficient embedded processor Arm Cortex-M7 and combines a 2.5D Graphics engine, sound processing, and an Arm® Cortex®-M0+ CPU for peripheral and security processing. Moreover, it includes a WVGA GFX and a PG-TEQFP-216 package. It is dedicated to automotive systems such as instrument clusters and Head-Up Displays (HUD).

Features

  • 240-MHz Arm® Cortex®-M7F Single
  • 4160KB code flash, 128KB work flash
  • 384 KB SRAM
  • 2,7 to 5.5 Supply Voltage
  • HSM (Hardware Security Module)
  • 108x programmable GPIO
  • 12x SCB / 2x LIN / 4x CAN FD Ch
  • 168x DMA Channels
  • -40°C - +125 °C Temperature Range
  • 216-TQFP Package

Benefits

  • Graphic solution up to 1920 x 720
  • Enabling ASIL-B designs
  • A/B swap SW update over the air support
  • Best-in-class power consumption
  • Cluster MCU Portfolio for a wide range
  • High level of graphics software re-use

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }