Active and preferred
RoHS Compliant

CYRS1069G30-10FZMB

Data Sheet
package

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CYRS1069G30-10FZMB
CYRS1069G30-10FZMB
Data Sheet

Product details

  • Density
    16 MBit
  • Device weight
    3878.7 mg
  • Family
    FAST SRAM
  • Interfaces
    Parallel
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    2.2 V to 3.6 V
  • Organization (X x Y)
    2Mb x 8
  • Planned to be available until at least
    2033
  • Qualification
    Military
Recommended
OPN
CYRS1069G30-10FZMB
Product Status active and preferred
Infineon Package
CG-FP-36
Package Name FLATPACK-36 (001-67583)
Packing Size 1
Packing Type CONTAINER
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
CG-FP-36
Package Name FLATPACK-36 (001-67583)
Packing Size 1
Packing Type CONTAINER
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon’s FAST 16Mb asynchronous SRAM family, designed with Infineon’s patented RADSTOPTM technology is ideal for space as well as other harsh environment applications. The 16Mb Fast SRAM is a high-performance, low power SRAM with ECC organized as 2-Mbit by 8-bits.
Infineon’s radiation hardened memories are QML-V certified, meeting the reliability and lifecycle demands of extreme environments. Our RADSTOPTM memory solutions enhance overall system computing limits while providing Size, Weight, and Power (SWaP) benefits and greater design flexibility.

Features

  • 16 Mb density, 2M x 8
  • Embedded ECC for single-bit error correction
  • 10ns access times
  • 2.2 V to 3.6 V operating voltage range
  • –55°C to +125°C military temperature grade
  • 36-pin ceramic flat pack (CFP)
  • DLAM QML-V qualified 
  • Radiation performance
  • TID: 200 Krad
  • SEL: > 60 MeV.cm2/mg @ 95°C
  • SEU: ≤ 1 x 10-10 upsets/bit-day

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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