Active and preferred
RoHS Compliant

CYBLE-416045-02

Data Sheet
package
board
ea.
in stock

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CYBLE-416045-02
CYBLE-416045-02
ea.
Data Sheet

Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SAR (1, 12-bit @ 1 msps)
  • Base Silicon
    PSoC™ 63-BLE
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    2 MByte/s
  • Bluetooth LE RX SENSITIVITY
    -92dBm
  • Bluetooth LE TX POWER
    4dBm
  • Bluetooth LE
    Yes
  • CapSense
    Yes
  • CPU Core
    150(M4)/100(M0) MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    1 MByte
  • GPIOs
    36
  • I2C
    Configurable
  • Launch Date
    31-03-2024
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M4
  • Operating Temperature
    -40 °C to 85 °C
  • Operational Amplifier
    Yes
  • Pads
    43
  • PDM
    Configurable
  • Planned to be available until at least
    31-03-2039
  • PWM
    32
  • ROM
    128KB
  • Secondary CPU Core
    Arm® Cortex®- M0
  • Serial Communication Blocks
    5
  • Size (X mm x Y mm x Z mm)
    14 x 18.5 x 2.00 mm
  • SPI
    Configurable
  • SRAM
    288 kByte
  • Type of Antenna
    PCB trace antenna
  • UART
    Configurable
  • V
    1.71 V to 3.6 V
Recommended
OPN
CYBLE-416045-02
Product Status active and preferred
Infineon Package
LG-MLGA-43
Package Name MODULE-43 (002-24085)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
LG-MLGA-43
Package Name MODULE-43 (002-24085)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon’s AIROC™ CYBLE-416045-02 is a fully certified Bluetooth® LE module based on Infineon’s PSOC™ 63 MCU with AIROC™ Bluetooth® LE. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core5.0 and is available in 14 x 18.5 x 2.00 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations.

Features

  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • Integrated trace antenna
  • PSOC™ 63-BLE Bluetooth® MCU

Benefits

  • Scalable and reconfigurable platform
  • Flexible automatic routing

Documents

Documents

Design resources

Partner solutions

Developer community

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