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END OF LIFE
discontinued
RoHS Compliant

CYBLE-012011-00

END OF LIFE
Data Sheet
package
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CYBLE-012011-00
CYBLE-012011-00
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Data Sheet

Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SAR (1, 12-bit @ 1 msps)
  • Base Silicon
    PSoC™ 4-BLE
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    1 MByte/s
  • Bluetooth LE RX SENSITIVITY
    - 93 dBm
  • Bluetooth LE TX POWER
    3dBm
  • Bluetooth LE
    Yes
  • CapSense
    Yes
  • CPU Core
    48MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    128 kByte
  • GPIOs
    23
  • I2C
    Configurable
  • Launch Date
    31-12-2009
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M0
  • Operating Temperature
    -40 °C to 85 °C
  • Operational Amplifier
    Yes
  • Pads
    31
  • PDM
    Configurable
  • Planned to be available until at least
    31-12-2024
  • PWM
    4
  • Secondary CPU Core
    None
  • Serial Communication Blocks
    5
  • Size (X mm x Y mm x Z mm)
    14 x 19 x 2.00 mm
  • SPI
    Configurable
  • SRAM
    16 kByte
  • Type of Antenna
    PCB trace antenna
  • UART
    Configurable
  • V
    1.9 V to 5.5 V
OPN
CYBLE-012011-00
Product Status discontinued
Infineon Package
LG-MLGA-31
Package Name MODULE-31 (002-02521)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
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Product Status discontinued
Infineon Package
LG-MLGA-31
Package Name MODULE-31 (002-02521)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
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