Active and preferred

CY7C2665KV18-550BZI

Data Sheet
package
ea.
in stock

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CY7C2665KV18-550BZI
CY7C2665KV18-550BZI
ea.
Data Sheet

Product details

  • Architecture
    QDR-II+, ODT
  • Bank Switching
    N
  • Burst Length (Words)
    4
  • Data Width
    x 36
  • Density
    144 MBit
  • ECC
    N
  • Family
    QDR-II+, ODT
  • Frequency
    550 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Pb
  • On-Die Termination
    Y
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Organization (X x Y)
    4Mb x 36
  • Peak Reflow Temp
    260 °C
  • Qualification
    Industrial
  • Read Latency (Cycles)
    2.5
Recommended
OPN
CY7C2665KV18-550BZI
Product Status active and preferred
Infineon Package
P-BGA-165
Package Name FBGA-165 (51-85195)
Packing Size 210
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant No
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
P-BGA-165
Package Name FBGA-165 (51-85195)
Packing Size 210
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

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