CY7C1480V33-167AXC
Active and preferred
RoHS Compliant
Lead-free

CY7C1480V33-167AXC

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CY7C1480V33-167AXC
CY7C1480V33-167AXC


Product details

  • Architecture
    Standard Sync, Pipeline SCD
  • Bank Switching
    N
  • Data Width
    x 36
  • Density
    72 MBit
  • ECC
    N
  • Family
    Standard Sync
  • Frequency
    167 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Pure Sn
  • On-Die Termination
    N
  • Operating Temperature range
    0 °C to 70 °C
  • Operating Voltage range
    3.14 V to 3.63 V
  • Organization (X x Y)
    2Mb x 36
  • Peak Reflow Temp
    260 °C
  • Qualification
    Commercial
  • Read Latency (Cycles)
    1

OPN
CY7C1480V33-167AXC
Product Status active and preferred
Infineon Package
Package Name TQFP-100 (51-85050)
Packing Size 144
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
TW
Country of Diffusion (CoD)
US
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name TQFP-100 (51-85050)
Packing Size 144
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
TW
Country of Diffusion (CoD)
US
CY7C1480V33-167AXC is a 72-Mbit (2M × 36) pipelined synchronous SRAM for high-speed cache and buffer memory. It runs from a 3.3 V core with 2.5 V/3.3 V JEDEC JESD8-5 I/O, and supports bus operation up to 167 MHz with 3.4 ns clock-to-output delay. Registered I/O, a 2-bit linear/interleaved burst counter, byte and global write, JTAG boundary scan, and ZZ sleep mode are included for power-down standby.

Features

  • Bus operation up to 200 MHz
  • 72-Mbit (2M × 36) sync SRAM
  • Registered I/O for pipelining
  • Clock-to-output tCO max 3.0 ns
  • Supports 3-1-1-1 burst access
  • Linear or interleaved burst mode
  • 2-bit wraparound burst counter
  • ADSP/ADSC address strobe inputs
  • Byte writes via BWE and BWX
  • Global write (GW) writes all bytes
  • ZZ sleep mode, IDDZZ max 120 mA
  • IEEE 1149.1 JTAG boundary scan

Benefits

  • 200 MHz supports high throughput
  • 36-bit width fits datapath buses
  • Pipelining boosts system frequency
  • 3.0 ns tCO helps timing closure
  • 3-1-1-1 bursts cut read latency
  • Match Intel or linear burst CPUs
  • Internal counter reduces logic
  • Flexible strobes ease interfacing
  • Byte write updates only needed data
  • Global write speeds block fills
  • Sleep mode lowers standby power
  • JTAG scan speeds board debug

Applications

Documents

Design resources

Developer community