Please note that this is an end of life product. Explore the product family for available alternatives. Please note that this is an end of life product. Explore the product family for available alternatives.
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CY7C1460KV25-200BZI
END OF LIFE
discontinued

CY7C1460KV25-200BZI

END OF LIFE

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CY7C1460KV25-200BZI
CY7C1460KV25-200BZI


Product details

  • Architecture
    NoBL, Pipeline
  • Bank Switching
    N
  • Data Width
    x 36
  • Density
    36 MBit
  • ECC
    N
  • Family
    NoBL
  • Frequency
    200 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Pb
  • On-Die Termination
    N
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    2.38 V to 2.63 V
  • Organization (X x Y)
    1Mb x 36
  • Peak Reflow Temp
    260 °C
  • Qualification
    Industrial
  • Read Latency (Cycles)
    1

OPN
CY7C1460KV25-200BZI
Product Status discontinued
Infineon Package
Package Name FBGA-165 (51-85195)
Packing Size 210
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant No
Country of Assembly (CoA)
TH
Country of Diffusion (CoD)
TW

Product Status discontinued
Infineon Package
Package Name FBGA-165 (51-85195)
Packing Size 210
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
TH
Country of Diffusion (CoD)
TW

Applications

Documents

Design resources

Developer community