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Infineon acquires C2i Semiconductors to expand its innovation capabilities in AI data center power management solutions
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Infineon acquires C2i Semiconductors to expand its innovation capabilities in AI data center power management solutions
Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Business & Financial Press
Aug 24, 2026
Business & Financial Press
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Business & Financial Press
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Quarterly Report
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Please note that this is an end of life product. See newer alternative product version
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CY7C1360C-200AXC
Product details
-
ArchitectureStandard Sync, Pipeline SCD
-
Bank SwitchingN
-
Data Widthx 36
-
Density9 MBit
-
ECCN
-
FamilyStandard Sync
-
Frequency200 MHz
-
InterfacesParallel
-
Lead Ball FinishNi/Pd/Au
-
On-Die TerminationN
-
Operating Temperature range0 °C to 70 °C
-
Operating Voltage range3.14 V to 3.63 V
-
Organization (X x Y)256Kb x 36
-
Peak Reflow Temp260 °C
-
QualificationCommercial
-
Read Latency (Cycles)1
|
OPN
|
CY7C1360C-200AXC |
|---|---|
| Product Status | discontinued |
| Infineon Package | |
| Package Name | TQFP-100 (51-85050) |
| Packing Size | 360 |
| Packing Type | TRAY |
| Moisture Level | 3 |
| Moisture Packing | DRY |
| Lead-free | No |
| Halogen Free | No |
| RoHS Compliant | Yes |
| Country of Assembly (CoA) |
TW
|
| Country of Diffusion (CoD) |
US
|
|
|
|
| Product Status | discontinued |
|---|---|
| Infineon Package | |
| Package Name | TQFP-100 (51-85050) |
| Packing Size | 360 |
| Packing Type | TRAY |
| Moisture Level | 3 |
| Moisture Packing | DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
TW
|
| Country of Diffusion (CoD) |
US
|
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