CY62167EV30LL-45BVXIT
Active and preferred
RoHS Compliant
Lead-free

CY62167EV30LL-45BVXIT

High-Density 16 MBit MoBL™ Parallel SRAM for Industrial Applications with Wide Temperature Range
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in stock

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CY62167EV30LL-45BVXIT
CY62167EV30LL-45BVXIT
ea.

Product details

  • Density
    16 MBit
  • Family
    MoBL™ SRAM
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    2.2 V to 3.6 V
  • Organization (X x Y)
    1M x 16
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Industrial
OPN
CY62167EV30LL-45BVXIT
Product Status active and preferred
Infineon Package
Package Name VFBGA-48 (51-85150)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name VFBGA-48 (51-85150)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CY62167EV30LL-45BVXIT is a 16-Mbit CMOS SRAM organized as 1M × 16 or 2M × 8 with 45 ns access. It operates from 2.2 V to 3.6 V over the Automotive-A range (–40°C to +85°C). Low-power operation includes automatic power-down when deselected, 1.5 µA typical standby (12 µA max), and 2.2 mA typical ICC at 1 MHz. It supports byte enables (BHE/BLE) and is offered in Pb-free 48-ball VFBGA.

Features

  • 16-Mbit SRAM, 1M×16 or 2M×8
  • 45 ns read/write cycle time
  • VCC operating range 2.2 V to 3.6 V
  • Automatic power-down on deselect
  • Standby current 1.5 µA typ
  • Active current 2.2 mA at 1 MHz typ
  • Data retention at VCC down to 1.5 V
  • ICCDR 10 µA max at VCC=1.5–3.0 V
  • OE/CE/BHE/BLE tri-state control
  • Input/output leakage ±1 µA max

Benefits

  • Fits 16-bit or 8-bit bus designs
  • 45 ns access supports fast reads
  • 2.2–3.6 V suits 3.3 V systems
  • Auto power-down cuts idle power
  • µA standby extends battery life
  • Low active current reduces heat
  • Retains data during VCC droop
  • 10 µA retention enables backup
  • Tri-state eases bus sharing/expand
  • Low leakage improves low-power IO
Documents

Design resources

Developer community

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