Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued
RoHS Compliant
Lead-free

CY62162G18-55BGXI

END OF LIFE
Data Sheet
package

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CY62162G18-55BGXI
CY62162G18-55BGXI
Data Sheet

Product details

  • Density
    16 MBit
  • Family
    MoBL™ SRAM
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage (VCCQ) max
    2.2 V
  • Operating Voltage
    1.65 V to 2.2 V
  • Organization (X x Y)
    512K x 32
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Industrial
  • Speed
    55 ns
OPN
CY62162G18-55BGXI
Product Status discontinued
Infineon Package
PG-BGA-119
Package Name BGA-119 (51-85115)
Packing Size 840
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
PG-BGA-119
Package Name BGA-119 (51-85115)
Packing Size 840
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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