Active and preferred
RoHS Compliant
Lead-free

CY15B108QI-20BFXI

Data Sheet
package

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CY15B108QI-20BFXI
CY15B108QI-20BFXI
Data Sheet

Product details

  • Density
    8 MBit
  • Family
    Excelon
  • Frequency
    20 MHz
  • Interfaces
    SPI
  • Lead Ball Finish
    Ni/Au
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    1.8 V to 3.6 V
  • Organization (X x Y)
    1Mb x 8
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Industrial
Recommended
OPN
CY15B108QI-20BFXI
Product Status active and preferred
Infineon Package
PG-UFLGA-8
Package Name LGA-8 (002-34146)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-UFLGA-8
Package Name LGA-8 (002-34146)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The CY15B108QI-20BFXI is an 8-Mbit EXCELON™ LP ferroelectric RAM (F-RAM) organized as 1024K × 8, delivering virtually unlimited endurance (10^15 read/write cycles) and 151-year data retention. Operating from 1.8 V to 3.6 V over -40°C to +85°C, it features a high-speed SPI interface up to 20 MHz, instant non-volatile writes at bus speed, advanced write protection, unique device ID, and a 256-byte special sector.

Features

  • 8-Mbit F-RAM, 1024K × 8 organization
  • Virtually unlimited 10^15 endurance
  • 151-year data retention at 60°C
  • Instant non-volatile write technology
  • Fast SPI interface up to 20 MHz
  • Supports SPI mode 0 and 3
  • Hardware and software write protection
  • Unique device ID and serial number
  • 256-byte special sector, reflow survivable
  • Low active current: 1.3 mA at 20 MHz
  • Deep power down: 0.90 µA (typ)
  • Hibernate mode: 0.1 µA (typ)

Benefits

  • Reliable for frequent, rapid data logging
  • No write delays, instant data storage
  • 151-year retention prevents data loss
  • High endurance reduces replacement cost
  • Fast SPI boosts system performance
  • Flexible integration with SPI modes
  • Robust data protection for safety
  • Device traceability with unique ID
  • Special sector survives soldering
  • Low power extends battery life
  • Deep sleep cuts standby consumption
  • Hibernate mode minimizes energy use

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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