Active and preferred
RoHS Compliant
Lead-free

BTM9021EP

MOTIX™ BTM9021EP is a fully integrated H-bridge motor driver with SPI interface & adjustable slew rate at two levels for an improved EMC performance.
Data Sheet
package
board
ea.
in stock

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BTM9021EP
BTM9021EP
ea.
Data Sheet

Product details

  • Classification
    ISO26262-ready
  • Over current detection min
    20 A
  • Planned to be available until at least
    2039
  • Qualification
    Automotive
  • RDSON_H(typ)
    42 mΩ
  • RDSON_L(typ)
    42 mΩ
  • Supply Voltage absolute max ratings
    40 V
  • Supply Voltage
    7 V to 18 V
  • Temperature
    -40 °C to 150 °C
Recommended
OPN
BTM9021EPXUMA1
Product Status active and preferred
Infineon Package
PG-TSDSO-14
Package Name N/A
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 2a
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TSDSO-14
Package Name -
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 2a
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The MOTIX™ BTM9021EP full-bridge IC provides a cost optimized solution for easy design in. The supply voltage of the device is at 7 V to 18 V. It suits automotive applications with limitation of minimum 20 A and covers PWM frequency of up to 20 kHz. BTM9021EP stands out due to its small (4,9 x 6,0mm) package with exposed pad leading to enhanced thermal conductivity. It features current sense for both, high side and low side.

Features

  • Supply voltage at 7 V to 18 V
  • Extended supply voltage 4.5 V - 40 V
  • Current limitation of minimum 20A
  • PWM operation up to 20kHz
  • AEC-Q100 qualified (Grade 1)
  • Adjustable slew rate at 2 levels
  • Internal charge pump
  • Half-bridge independent mode
  • Current sense for high side and low side
  • On-state open load detection
  • SPI interface
  • Watchdog

Benefits

  • Small package with very low pin count
  • No need for external capacitors
  • Costs savings
  • Enhanced thermal conduction, exposed pad
  • More flexible half bridge control
  • Optimized EMC performance

Applications

Diagrams

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Documents

Design resources

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