AS5966
coming soon
coming soon
RoHS Compliant
Lead-free

AS5966

4-Side Buttable 80-Pixel TSV ASIC with integrated PD array and ADC
Datasheet

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AS5966
AS5966
Datasheet


Product details


OPN
AS5966-WLP-SAW
Product Status coming soon
Infineon Package --
Package Name N/A
Packing Size 1
Packing Type HORIZONTAL FRAME SHIPPER
Moisture Level N/A
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT

Product Status coming soon
Infineon Package --
Package Name -
Packing Size 1
Packing Type HORIZONTAL FRAME SHIPPER
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
The AS5966 is a sensor chip for CT detectors that combines the photodiodes and the readout circuit on a single CMOS chip using through silicon vias (TSV). This sensor solution, which integrates 10 x 8 photodiodes array with pixel dimension of 1.1x1.02 mm² and an 80-channel ADC on top of each other, allowing the assembly of the pixel array on four adjacent edges of the device. It has high performance incl. ultra-low noise and power consumption.

Features

  • ADC and PD integration using TSV technology
  • Lowest input related noise of 0.38 fC
  • Low power dissipation of 0.94 mW/pixel
  • Integration time of min. 195.5 μs
  • 15 MHz CMOS level interface

Benefits

  • 4-Side Buttable for Z-coverage of 2-16 cm
  • Pixel size 1.1 x 1.02 mm² with customization
  • No need of X-ray shield for ADC protection

Applications

Documents

Design resources

Partner solutions

Developer community