PG-TO263-7-2

Package details

  • Package Material
    PG
  • Package Family
    PG-TO263
  • Terminals
    7
  • Variant
    2
  • Exposed Paddle
    Yes
  • Body Length (mm)
    10.0
  • Body Width (mm)
    9.25
  • Min. Terminal Pitch (mm)
    1.27
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1000
    1
    330
Infineon surface mount transistor outline (TO) packages are offered as various families. Infineon TO SMD packages are available as DPAK and D2PAK with with a mold body size of approx. 6 to 9 mm. Infineon designations are following the standardized names TO-252 and TO-263 as given by JEDEC. PG-TO252 DPAK, PG-TO263 D2PAK. The I/O leads of the single-ended SMD packages are bent outwards from the package mold body side forming a distinct 'foot' and 'heel' geometry. That 'gullwing' shaped lead geometry can be mounted on the same board surface together with the heat sink pad using fully automated processes. The gullwing shaped leads altransistor for high-throughput board mounting using surface mount technology (SMT). Typical products are diodes, transistors, linear voltage regulators, switches, IGBT discretes, half-bridge ICs, linear drivers, and more.

Image Gallery

PG-TO263-7-2,-3_TP
PG-TO263-7-2,-3_TP
PG-TO263-7-2,-3_TP PG-TO263-7-2,-3_TP PG-TO263-7-2,-3_TP
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Documents and drawings

Documents and drawings