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Infineon wins another patent infringement case against Innoscience
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Infineon successfully completes acquisition of non-optical analog/mixed-signal sensor portfolio from ams OSRAM
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Infineon wins another patent infringement case against Innoscience
An impulse for Germany, Europe and the world: Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
Infineon receives additional prestigious award for outstanding Investor Relations work
Infineon successfully completes acquisition of non-optical analog/mixed-signal sensor portfolio from ams OSRAM
Business & Financial Press
Jul 03, 2026
Business & Financial Press
Jul 02, 2026
Business & Financial Press
Jul 01, 2026
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CERAMIC-TSOP-44 (002-33895)
CG-FP-44-1
Package details
-
Package MaterialCG
-
Package FamilyCG-FP
-
Terminals44
-
Variant1
-
Exposed PaddleNo
-
Body Length (mm)18.415
-
Body Width (mm)10.16
-
Min. Terminal Pitch (mm)1.27
-
CONTAINERPieces/BoxTubes/Box11
Infineon flatpack (FP) packages are offered as different families.
The flat lead connection design allows for board mounting using surface mount technology (SMT).
Typical products are power ICs, solid state relays, and memories.
Documents and drawings
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