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Infineon marks innovation milestone with world’s first300-millimeter power silicon carbide (SiC) wafer
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Infineon marks innovation milestone with world’s first300-millimeter power silicon carbide (SiC) wafer
Infineon redefines real-time compute and control for software-defined vehicles and Physical AI with new AURIX™ RC1
Infineon enables car computers for automated driving and digital cockpits powered by Qualcomm Snapdragon Ride
Infineon to establish the world’s first high-volume manufacturing facility for gallium nitride power semiconductors on 300-millimeter wafers in Europe
Business & Financial Press
Nov 09, 2026
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