IM70A135 | High performance analog XENSIV™ MEMS microphone

Overview

Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm³. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.

Summary of Features

Very High 70dB(A) Signal-to-noise ratio
Ultra-low power modes for battery critical applications (170/70µA)
Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
Ultra-high acoustic overload point (AOP) of 135dBSPL
Very tight part-to-part phase and sensitivity matching (± 1dB)
Flat frequency response with a low LFRO (low frequency roll-off) of 37Hz

Benefits

Powerful far-field and low volume audio pick-up
Crystal clear audio signals even in compact package size
Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Potential Applications