SOT-223

Overview

CoolMOS™ P7 and CoolMOS™ CE superjunction MOSFETs in SOT-223 package

Cost-effective drop-in replacement for DPAK

Infineon provides the first complete high voltage MOSFET portfolio in a SOT-223 package worldwide to reduce the overall bill of material (BOM). The new CoolMOS™ P7 and the CoolMOS™ CE series are available in 500V, 600V, 650V, 700V, 800V or 950V in the cost-effective SOT-223 package which fits to common DPAK properties.

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Details

Thermal behavior similar to DPAK

The thermal behavior of the SOT-223 depends on the layout of the board and on the power consumed. We have measured the thermals in a test environment and compared with a simulation.

Thermal behavior similar to DPAK

~2°C–3°C temperature increase on DPAK footprint as DPAK
Same temperature on footprint of DPAK + 20mm additional copper area
10°C temperature increase on SOT-223 footprint

The thermal measurements in several applications were confirmed by simulation with T _ambient= 70°C and P _loss= 250mW. The simulations confirm that on a DPAK footprint a 2°C–3°C temperature increase versus DPAK is expected, while for the copper areas of 20mm additional copper the temperature is equal to the DPAK temperature.

SOT-223 package footprint

The SOT-223 package without the middle pin is fully compatible to the footprint of a DPAK and therefore allows a one-to-one drop-in replacement and second sourcing at lower cost.

SOT-223 package footprint

Combining excellent performance and ease-of-use with a cost-effective package solution

Having introduced the SOT-223 package with CoolMOS™ CE SJ MOSFET in 2016, Infineon is now enabling its customers to also enjoy the benefits of CoolMOS™ P7 in combination with the cost- effective drop-in replacement for DPAK. CoolMOS™ P7 is designed to address typical challenges in the low power SMPS market, by offering excellent performance and ease-of-use, enabling improved form factors and price competitiveness. This combination makes CoolMOS™ P7 SJ MOSFET in SOT-223 a perfect fit for the target applications – charger, adapter, TV SMPS and lighting SMPS.

Target applications of CoolMOS™ P7 in SOT-223

Key features and benefits of CoolMOS™ P7 SJ MOSFET in SOT-223

Best-fit performance superjunction technology

Enabling lower MOSFET chip temperature
Leading to higher efficiency compared to previous technologies
Allowing improved form factors and slim designs

Cost-effective package solution

Drop-in replacement for DPAK at competitive cost
Space savings in designs with low power dissipation; enabling smaller form factors
Comparable thermal behavior to DPAK

Best-in-class price/performance ratio

Attractive price position for high performance technology

Infineon’s SOT-223 package was first introduced in 2016 with the CoolMOS™ CE series and is specifically targeting mobile charger applications and the decreasing power ratings of LED lighting applications. The SOT-223 package is a cost effective alternative to DPAK that also enables footprint reduction in some designs. The package can be placed on a typical DPAK footprint and comes with only a small compromise in thermal behavior.

Key features and benefits

High efficiency and good EMI behavior
No major disadvantage in thermals
Reduced bill of material (BOM) cost
Space savings in compact designs and improved form factors

Target applications

Lighting
Adapter
Consumer

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Simulation

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