Fitness bands

Overview

Infineon provides hardware and software for fitness bands and wristbands. Partition always-on sensing and Edge AI across low-power and high-performance domains, connect with AIROC™ Bluetooth® LE, add secure NFC, and integrate XENSIV™ sensors and CAPSENSE™ touch. Reduce power, PCB area, BOM complexity, and development effort while protecting user data.

Benefits

  • Optimize system power budget
  • Partition Edge AI workloads
  • Reduce BOM and PCB area
  • Integrate secure NFC payments
  • Validate reliable Bluetooth® LE
  • Measure altitude and movement
  • Design robust touch interfaces
  • Speed development with proven tools

Block diagram

About

Partition Edge AI for performance and low power

PSOC™ Edge gives engineers separate high-performance and low-power compute domains for efficient workload partitioning. Use the Arm® Cortex®-M55 with Helium™ DSP and, on selected devices, the Ethos™-U55 NPU for demanding inference. Keep always-on sensing on the Cortex®-M33 with Infineon's NNLite accelerator, then wake higher-performance resources only when required. Up to 6 MB SRAM, ultra-low-power RRAM, integrated analog and HMI interfaces, and a rich peripheral set help reduce external components. A secured enclave and Edge Protect technology support data protection, while ModusToolbox™ libraries, board support packages, middleware, and DEEPCRAFT™ tools accelerate model deployment and prototyping.

Evaluate PSOC™ Edge MCUs
Start with the PSOC™ Edge E84 AI Kit

Integrate secure NFC payments with less design effort

SECORA™ Connect X helps engineers add secure NFC payments and credential functions within tight power and PCB constraints. The turnkey solution combines secure provisioning and storage with pre-certified payment applications and contactless performance. Fast host integration via I2C, boosted NFC, and approximately 2 µA standby current suit battery-powered wearables. Its 2.5 × 2.5 × 0.6 mm package and simplified external circuitry can reduce BOM by up to 60%. An evaluation kit and application support help shorten integration, certification, and time to market.

Discover SECORA™ Connect X
Read the SECORA™ Connect X brief

Engineer reliable, low-power Bluetooth® LE links

AIROC™ CYW20829 gives engineers a secure Bluetooth® LE 5.4 platform built around a 96 MHz Arm® Cortex®-M33 MCU with 256 KB RAM. Receiver sensitivity down to −106 dBm supports robust links when compact enclosures and constrained antennas limit RF performance. Low-power operation helps preserve the fitness band's energy budget, while integrated security, analog-to-digital conversion, audio input, and standard serial peripherals can reduce companion components. A mature Bluetooth stack, development tools, and ModusToolbox™ support simplify profile implementation, RF evaluation, firmware integration, and validation.

View AIROC™ CYW20829 details
Start with the CYW20829 evaluation kit

Design precise, waterproof pressure sensing

XENSIV™ DPS368 gives engineers calibrated pressure and temperature data for altitude, elevation, and body-movement algorithms. It delivers precision down to ±0.002 hPa, or approximately ±2 cm, with fast, low-noise readout. Average current is 1.7 µA at a 1 Hz pressure measurement rate, with 0.5 µA standby current, supporting tight wearable power budgets. The 2.0 × 2.5 × 1.1 mm package saves PCB area, and IPX8 protection supports operation around water, dust, and humidity. An integrated FIFO reduces host polling, while I2C, SPI, and interrupt support simplify sensor-hub integration.

Evaluate XENSIV™ DPS368
Start with the DPS368 Shield2Go kit

Build robust, ultra-low-power touch interfaces

PSOC™ 4000T combines a 48 MHz Arm® Cortex®-M0+, up to 64 KB flash, up to 8 KB SRAM, and fifth-generation CAPSENSE™ in one compact device. Engineers can implement buttons, sliders, proximity, hover, and inductive sensing without a separate touch controller. Deep sleep current of 6 µA and active touch detection at 200 µA support always-on interfaces within a constrained power budget. High signal-to-noise performance and liquid tolerance improve operation with sweat, rain, and electrical noise. Up to 21 I/Os, two serial blocks, ModusToolbox™ support, and migration compatibility simplify schematic design, tuning, and firmware reuse.

Design with PSOC™ 4000T
Start with the PSOC™ 4000T kit

Add clear, low-power audio and voice capture

XENSIV™ MEMS microphones provide engineers with low-noise, low-distortion audio input for voice commands, calls, and acoustic-event processing. High signal-to-noise ratio, high acoustic overload capability, tight sensitivity matching, and low-latency wideband response create a clean signal for downstream algorithms. Selectable power modes help balance capture quality and battery life, while compact analog-output and digital PDM options simplify mechanical and electrical integration. Pair the microphone with PSOC™ Edge and DEEPCRAFT™ audio and voice software to prototype local wake-word, noise-suppression, and voice-interface pipelines with lower latency and reduced cloud dependence.

Explore XENSIV™ MEMS microphones
Try DEEPCRAFT™ Voice Assistant

Partition Edge AI for performance and low power

PSOC™ Edge gives engineers separate high-performance and low-power compute domains for efficient workload partitioning. Use the Arm® Cortex®-M55 with Helium™ DSP and, on selected devices, the Ethos™-U55 NPU for demanding inference. Keep always-on sensing on the Cortex®-M33 with Infineon's NNLite accelerator, then wake higher-performance resources only when required. Up to 6 MB SRAM, ultra-low-power RRAM, integrated analog and HMI interfaces, and a rich peripheral set help reduce external components. A secured enclave and Edge Protect technology support data protection, while ModusToolbox™ libraries, board support packages, middleware, and DEEPCRAFT™ tools accelerate model deployment and prototyping.

Evaluate PSOC™ Edge MCUs
Start with the PSOC™ Edge E84 AI Kit

Integrate secure NFC payments with less design effort

SECORA™ Connect X helps engineers add secure NFC payments and credential functions within tight power and PCB constraints. The turnkey solution combines secure provisioning and storage with pre-certified payment applications and contactless performance. Fast host integration via I2C, boosted NFC, and approximately 2 µA standby current suit battery-powered wearables. Its 2.5 × 2.5 × 0.6 mm package and simplified external circuitry can reduce BOM by up to 60%. An evaluation kit and application support help shorten integration, certification, and time to market.

Discover SECORA™ Connect X
Read the SECORA™ Connect X brief

Engineer reliable, low-power Bluetooth® LE links

AIROC™ CYW20829 gives engineers a secure Bluetooth® LE 5.4 platform built around a 96 MHz Arm® Cortex®-M33 MCU with 256 KB RAM. Receiver sensitivity down to −106 dBm supports robust links when compact enclosures and constrained antennas limit RF performance. Low-power operation helps preserve the fitness band's energy budget, while integrated security, analog-to-digital conversion, audio input, and standard serial peripherals can reduce companion components. A mature Bluetooth stack, development tools, and ModusToolbox™ support simplify profile implementation, RF evaluation, firmware integration, and validation.

View AIROC™ CYW20829 details
Start with the CYW20829 evaluation kit

Design precise, waterproof pressure sensing

XENSIV™ DPS368 gives engineers calibrated pressure and temperature data for altitude, elevation, and body-movement algorithms. It delivers precision down to ±0.002 hPa, or approximately ±2 cm, with fast, low-noise readout. Average current is 1.7 µA at a 1 Hz pressure measurement rate, with 0.5 µA standby current, supporting tight wearable power budgets. The 2.0 × 2.5 × 1.1 mm package saves PCB area, and IPX8 protection supports operation around water, dust, and humidity. An integrated FIFO reduces host polling, while I2C, SPI, and interrupt support simplify sensor-hub integration.

Evaluate XENSIV™ DPS368
Start with the DPS368 Shield2Go kit

Build robust, ultra-low-power touch interfaces

PSOC™ 4000T combines a 48 MHz Arm® Cortex®-M0+, up to 64 KB flash, up to 8 KB SRAM, and fifth-generation CAPSENSE™ in one compact device. Engineers can implement buttons, sliders, proximity, hover, and inductive sensing without a separate touch controller. Deep sleep current of 6 µA and active touch detection at 200 µA support always-on interfaces within a constrained power budget. High signal-to-noise performance and liquid tolerance improve operation with sweat, rain, and electrical noise. Up to 21 I/Os, two serial blocks, ModusToolbox™ support, and migration compatibility simplify schematic design, tuning, and firmware reuse.

Design with PSOC™ 4000T
Start with the PSOC™ 4000T kit

Add clear, low-power audio and voice capture

XENSIV™ MEMS microphones provide engineers with low-noise, low-distortion audio input for voice commands, calls, and acoustic-event processing. High signal-to-noise ratio, high acoustic overload capability, tight sensitivity matching, and low-latency wideband response create a clean signal for downstream algorithms. Selectable power modes help balance capture quality and battery life, while compact analog-output and digital PDM options simplify mechanical and electrical integration. Pair the microphone with PSOC™ Edge and DEEPCRAFT™ audio and voice software to prototype local wake-word, noise-suppression, and voice-interface pipelines with lower latency and reduced cloud dependence.

Explore XENSIV™ MEMS microphones
Try DEEPCRAFT™ Voice Assistant
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