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Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Infineon and LS ELECTRIC collaborate to advance high-efficiency direct current power solutions for AI data centers
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Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Infineon and LS ELECTRIC collaborate to advance high-efficiency direct current power solutions for AI data centers
Business & Financial Press
Aug 21, 2026
Business & Financial Press
Aug 10, 2026
Quarterly Report
Aug 05, 2026
Business & Financial Press
Jul 13, 2026
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×
Active and preferred
RoHS Compliant
SLN37GDA100KM
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SLN37GDA100KM
Product details
-
Asymmetric CryptographyECC up to 521-bit, RSA up to 4096-bit
-
CertificationsePass eSign CC EAL5+ high targeted
-
EEPROM100 kByte
-
InterfacesISO 14443 A/B, ISO 7816
-
Leading TechnologiesARM(R) SecureCore300 SC300
-
OS ProviderMasktech (MTCOS ID 2.6)
-
Product DescriptionNative generic ID platform for ePKI use case
-
Supported StandardsISO/IEC 18013
-
Symmetric CryptographyAES up to 256-bit, DES, 3DES
-
Use CaseseSignature
| Recommended | |
|
OPN
|
|
| Product Status | active and preferred |
| Infineon Package | S-COM10.8-6 |
| Package Name | N/A |
| Packing Size | 1 |
| Packing Type | REEL FOR CHIP CARD |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead-free | No |
| Halogen Free | Yes |
| RoHS Compliant | Yes |
|
|
|
| Product Status |
Active
|
|---|---|
| Infineon Package | S-COM10.8-6 |
| Package Name | - |
| Packing Size | 1 |
| Packing Type | REEL FOR CHIP CARD |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
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