Active and preferred
RoHS Compliant
Lead-free

S70FL01GSAGBHMC10

Data Sheet
package
software

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S70FL01GSAGBHMC10
S70FL01GSAGBHMC10
Data Sheet

Product details

  • Classification
    ISO 26262-ready
  • Density
    1 GBit
  • Family
    FL-S
  • Interface Bandwidth
    66 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / -
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 125 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Currently planned availability until at least
    2033
  • Qualification
    Automotive
Recommended
OPN
S70FL01GSAGBHMC10
Product Status active and preferred
Infineon Package
PG-TFBGA-24
Package Name FBGA-24 (002-15078)
Packing Size 676
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TFBGA-24
Package Name FBGA-24 (002-15078)
Packing Size 676
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Features

  • Single, dual, and quad SPI support
  • Execute in Place (XiP)
  • Advanced Sector Protection (ASP)
  • Twenty-year data retention
  • 100 k cycles endurance

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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