Active
RoHS Compliant
Lead-free

S26KL256SDABHI030

Data Sheet
package
software

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S26KL256SDABHI030
S26KL256SDABHI030
Data Sheet

Product details

  • Bus Width
    x8
  • Density
    256 MBit
  • Family
    KL-S
  • Initial Access Time
    96 ns
  • Interface Bandwidth
    200 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 100
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Currently planned availability until at least
    2033
  • Qualification
    Industrial
  • Technology
    HYPERFLASH
Recommended
OPN
S26KL256SDABHI030
Product Status active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 1690
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-15550)
Packing Size 1690
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Features

  • DDR x8 interface
  • Error Checking and Correction (ECC)
  • Advanced Sector Protection (ASP)
  • 6x8 mm 24-ball BGA package
  • Twenty-year data retention
  • 100 k cycles endurance

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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