Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
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END OF LIFE
discontinued
RoHS Compliant
Lead-free

S25FL127SABMFB100

END OF LIFE

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Product details

  • Classification
    ISO 26262-ready
  • Density
    128 MBit
  • Family
    FL-S
  • Interface Bandwidth
    54 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    108 / -
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Matte Tin Plating
  • Operating Temperature
    -40 °C to 105 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Qualification
    Automotive
OPN
S25FL127SABMFB100
Product Status discontinued
Infineon Package
Package Name SOIC-8 (002-15548)
Packing Size 280
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
Package Name SOIC-8 (002-15548)
Packing Size 280
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S25FL127S is a 128 Mb SPI multi-I/O flash memory using 65-nm MIRRORBIT™ technology and Eclipse architecture for fast program and erase performance. It supports single, dual, and quad SPI commands, with read rates up to 54 MBps. Operating from 2.7 V to 3.6 V across -40°C to 125°C, it offers 100,000 cycles endurance, 20-year data retention, and advanced security features including OTP and sector protection. Typical uses are code shadowing, XIP, and storage.

Features

  • CMOS 3.0 V core
  • 128 Mb (16 MB) density
  • SPI with multi-I/O support
  • 24- or 32-bit address options
  • Read commands: Normal, Fast, Dual, Quad
  • AutoBoot for automatic read on power-up/reset
  • 256- or 512-byte page programming buffer
  • Internal ECC with single bit error correction
  • Hybrid and uniform sector erase options
  • 100,000 program-erase cycles per sector
  • 20 year data retention
  • 1024-byte one-time programmable (OTP) array

Benefits

  • Low voltage operation reduces power use
  • High density enables large code/data storage
  • Flexible SPI I/O boosts system compatibility
  • Extended addressing supports large designs
  • Multiple read modes optimize speed
  • AutoBoot accelerates system startup
  • Large buffers speed up programming
  • ECC improves data reliability
  • Flexible erase options fit various needs
  • High endurance lowers maintenance cost
  • Long retention ensures data safety
  • OTP region adds secure storage

Applications

Documents

Design resources

Developer community

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