NEW
Active and preferred
RoHS Compliant
Lead-free

PSE822GOS4DFNC4T

NEW
Data Sheet

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PSE822GOS4DFNC4T
PSE822GOS4DFNC4T
Data Sheet

Product details

  • A/D Input Lines
    1
  • ADC (#, Max. Resolution @ Sample Rate)
    SAR (1, 12-20 bit @ 5 msps)
  • Additional Features
    Helium DSP, NNLite NPU, EPC4 Security, 2.5D GPU
  • BLE Maximum Data Rate
    N/A
  • BLE Power Output
    N/A
  • BLE RX Sensitivity
    N/A
  • BLE Supported Frequency band
    N/A
  • CAN
    0
  • CapSense
    N
  • Communication Interfaces
    I2C, SPI, UART
  • Comparators
    0
  • CPU
    ARM Cortex-M55
  • Cryptographics Accelerator
    Y
  • DAC (#, Max. Resolution @ Sample Rate)
    (1,12-bit)
  • Development Software
    ModusToolbox™
  • DMA Channels
    32
  • Family
    PSOC Edge E82
  • Floating Point Unit
    Y
  • Frequency
    400 MHz
  • I/O Pins (Smart)
    16 to 101
  • I2S
    2
  • LCD Direct Drive
    N
  • Lead Ball Finish
    Sn/Ag/Cu
  • Number of ADC Modules
    1
  • Operating Temperature min
    -20 °C
  • Operating Temperature max
    70 °C
  • Operating Voltage
    1.71 V to 3.6 V
  • Operational Amplifier
    2
  • PDM-PCM
    4
  • Peak Reflow Temp
    260 °C
  • Quad-SPI
    2
  • Qualification
    Commercial
  • Real Time Clock
    Y
  • Secondary Core
    ARM Cortex-M33
  • Serial Communication Blocks
    9
  • SRAM
    4096 kByte
  • Timer/Counter/PWM Blocks
    32
  • Universal Digital Blocks
    0
  • USB I/O
    2
  • USB Type
    USB 2.0 HS/FS
Recommended
OPN
PSE822GOS4DFNC4TXTMA1
Product Status active and preferred
Infineon Package SG-XFWLB-154
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package SG-XFWLB-154
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

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Documents

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