Active
RoHS Compliant

IRFR3910

100V Single N-Channel IR MOSFET in a D-Pak package
Multiple OPNs available
ea.

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Product details

  • Budgetary Price €/1k
    0.24
  • ID (@25°C) max
    16 A, 16 A
  • Moisture Sensitivity Level
    1
  • Mounting
    SMD
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    DPAK (TO-252)
  • Polarity
    N
  • Ptot max
    52 W
  • Qgd
    14 nC
  • QG (typ @10V)
    29.3 nC, 29.3 nC
  • RDS (on) (@10V) max
    115 mΩ, 115 mΩ
  • RthJC max
    2.4 K/W
  • Tj max
    175 °C
  • VDS max
    100 V
  • VGS(th)
    3 V, 3 V
  • VGS max
    20 V
OPN
IRFR3910TRPBF IRFR3910PBF IRFR3910TRLPBF
Product Status active discontinued discontinued
Infineon Package
Package Name DPAK DPAK DPAK
Packing Size 2000 3000 3000
Packing Type TAPE & REEL TUBE TAPE & REEL LEFT
Moisture Level 1 1 1
Moisture Packing NON DRY NON DRY NON DRY
Lead-free No No No
Halogen Free Yes Yes Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name DPAK
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status discontinued
Infineon Package
Package Name DPAK
Packing Size 3000
Packing Type TUBE
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status discontinued
Infineon Package
Package Name DPAK
Packing Size 3000
Packing Type TAPE & REEL LEFT
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.

Features

  • Planar cell structure for wide SOA
  • Optimized for broadest availability
  • Product qualification according to JEDEC
  • Silicon optimized for applications
  • Industry standard surface mount package

Benefits

  • Increased ruggedness
  • Wide availability at distribution
  • Industry standard qualification level
  • High performance, low-frequency
  • Drop-in replacement with standard pinout

Applications

Documents

Design resources

Developer community

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