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Infineon acquires C2i Semiconductors to expand its innovation capabilities in AI data center power management solutions
Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
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IPB45N06S4L-08
Product details
-
Budgetary Price €/1k0.51
-
Country of Assembly (Last BE site, current, subject to change)Mexico, Malaysia
-
Country of Diffusion (Last FE site, current, subject to change)Malaysia
-
ID (@25°C) max45 A
-
IDpuls max180 A
-
Launch year2009
-
Operating Temperature range-55 °C to 175 °C
-
PackageD2PAK (PG-TO263-3)
-
Planned to be available until at least2027
-
PolarityN
-
Ptot max71 W
-
QG (typ @10V) max64 nC
-
QG (typ @10V)49 nC
-
QualificationAutomotive
-
RDS (on) (@10V) max7.9 mΩ
-
RthJC max2.1 K/W
-
TechnologyOptiMOS™T2
-
VDS max60 V
-
VGS(th) range1.2 V to 2.2 V
-
VGS(th)1.7 V
|
OPN
|
IPB45N06S4L08ATMA3 |
|---|---|
| Product Status | not for new design |
| Infineon Package | |
| Package Name | D2PAK |
| Packing Size | 1000 |
| Packing Type | TAPE & REEL |
| Moisture Level | 1 |
| Moisture Packing | NON DRY |
| Lead-free | No |
| Halogen Free | Yes |
| RoHS Compliant | Yes |
| Country of Assembly (CoA) |
MY
|
| Country of Diffusion (CoD) |
MY
|
|
|
|
| Product Status | not for new design |
|---|---|
| Infineon Package | |
| Package Name | D2PAK |
| Packing Size | 1000 |
| Packing Type | TAPE & REEL |
| Moisture Level | 1 |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
MY
|
| Country of Diffusion (CoD) |
MY
|
Features
- N-channel - Enhancement mode
- Automotive AEC Q101 qualified
- MSL1 up to 260°C peak reflow
- 175°C operating temperature
- Green package (RoHS compliant)
- 100% Avalanche tested
- PPAP Capable Device
Benefits
- Highest current capability
- Lowest switching and conduction losses
- High thermal efficiency
- Robust packages & superior quality
- Optimal total gate charge
- Smaller drivers output stages
Applications
Documents
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