IMDQ75B032M2H
NEW
Active and preferred
RoHS Compliant
Lead-free

IMDQ75B032M2H

NEW
CoolSiC™ MOSFET bidirectional switch (BDS) 750 V
Datasheet
package

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

IMDQ75B032M2H
IMDQ75B032M2H
Datasheet


Product details

  • ID (@25°C) max
    74 A
  • Operating Temperature range
    -55 °C to 175 °C
  • Package
    Q-DPAK
  • Polarity
    N
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C) max
    40 mΩ
  • RDS (on) (@ Tj = 25°C)
    32 mΩ
  • Technology
    CoolSiC™ BDS G2
  • VDS max
    750 V

Recommended
OPN
IMDQ75B032M2HXTMA1
Product Status active and preferred
Infineon Package
PG-HDSOP-22
Package Name Q-DPAK
Packing Size 750
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
MY
Country of Diffusion (CoD)
AT

Product Status
Active
Infineon Package
PG-HDSOP-22
Package Name Q-DPAK
Packing Size 750
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
MY
Country of Diffusion (CoD)
AT
Built on the rugged CoolSiC™ G2 technology, the IMDQ75B032M2H integrates two SiC power switches in a dual‑die common‑drain architecture within a top‑side‑cooled  Q‑DPAK package, simplifying system design and enabling  next‑generation topologies. Designed for modern power grids and  energy systems, it delivers high reliability, efficiency, and low lifetime TCO.

Features

  • Two dies in back to back
  • Overload capability 200°C for 100h
  • Ready for native liquid cooling
  • 2 μs Short circuit ruggedness
  • 100% avalanche tested
  • 840 Vbr maximum
  • 2.3 mm package height

Benefits

  • Enhanced lifetime
  • Lowest system TCO
  • Replaces two Q-DPAK standalone devices
  • 66% lower parasitics over TO247-4
  • Superior compact cell design
  • Better PCB utilization using both side
  • Support conduction and liquid cooling

Applications

Documents

Design resources

Partner solutions

Developer community