NEW
Active and preferred
RoHS Compliant

IAUCN08S5L160T

NEW
80 V, N-Ch, 15.8 mΩ max, Automotive MOSFET, top-side cooled SSO10T (5x7), OptiMOS™ 5
Data Sheet
package

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IAUCN08S5L160T
IAUCN08S5L160T
Data Sheet

Product details

  • ID (@25°C) max
    42 A
  • Operating Temperature range
    -55 °C to 175 °C
  • Package
    PG-LHDSO-10
  • Planned to be available until at least
    2040
  • Polarity
    N
  • QG (typ @10V) max
    19 nC
  • QG (typ @10V)
    15 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    15.8 mΩ
  • Technology
    OptiMOS™5
  • VDS max
    80 V
  • VGS(th) range
    1.2 V to 2 V
  • VGS(th)
    1.6 V
Recommended
OPN
IAUCN08S5L160TATMA1
Product Status active and preferred
Infineon Package
PG-LHDSO-10
Package Name SSO10T
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-LHDSO-10
Package Name SSO10T
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
IAUCN08S5L160T is an automotive MOSFET built with Infineon’s innovative, top-side cooled SSO10T 5x7mm2 SMD package. The SSO10T package helps customers achieve big advancements in cooling and power density. This product also utilizes Infineon’s OptiMOS™ 5 80 V power semiconductor technology. It is designed specifically for the high performance, quality, and robustness needed for demanding automotive applications.

Features

  • Direct cooling path to ECU housing
  • Virtually no heat flows into PCB
  • Industry’s largest exposed pad area
  • Freedom to route traces under package
  • Can mount parts on back side of PCB
  • Fast switching times (turn on/off)
  • Extended qualification beyond AEC-Q101
  • Enhanced electrical testing
  • Package is listed with JEDEC

Benefits

  • Direct cooling path to ECU housing
  • Virtually no heat flows into PCB
  • Industry’s largest exposed pad area
  • Freedom to route traces under package
  • Can mount parts on back side of PCB
  • Fast switching times (turn on/off)
  • Extended qualification beyond AEC-Q101
  • Enhanced electrical testing
  • Package is listed with JEDEC

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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