not for new design
RoHS Compliant

FF650R17IE4V

1700 V, 650 A dual IGBT module

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FF650R17IE4V
FF650R17IE4V

Product details

  • Configuration
    half-bridge
  • Dimensions (width)
    89 mm
  • Dimensions (length)
    172 mm
  • Housing
    PrimePACK™ 2
  • IC(nom) / IF(nom)
    650 A
  • IC max
    650 A
  • Qualification
    Industrial
  • Technology
    IGBT4 - E4
  • VCE(sat) (Tvj=25°C typ)
    2 V
  • VCES / VRRM
    1700 V
  • VF (Tvj=25°C typ)
    1.85 V
  • Voltage Class max
    1700 V
OPN
FF650R17IE4VBOSA1
Product Status not for new design
Infineon Package AG-PRIME2
Package Name N/A
Packing Size 3
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status not for new design
Infineon Package AG-PRIME2
Package Name -
Packing Size 3
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
PrimePACK™ 2 1700 V, 650 A half-bridge dual IGBT module especially developed for CAV applications. Including TRENCHSTOP™ IGBT4, NTC and fast switching chip.

Features

  • Vibration robustness up to 15g
  • Extended operation temp. Tvj op
  • High DC stability
  • High current density
  • Low switching losses
  • Tvj op = 150°C
  • Low VCEsat
  • Package with CTI > 400
  • High creepage & clearance distances
  • High cycling capabilities
  • Copper base plate
  • UL recognized

Applications

Documents

Design resources

Developer community

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