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Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer
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FB30R07W2T7P_C54
Product details
-
Configuration2 -level
-
Featuressolder pin, TIM
-
HousingEasyPIM™ 2B
-
IC(nom) / IF(nom)30 A
-
IC max30 A
-
QualificationIndustrial
-
TechnologyIGBT7 - T7
-
VCES / VRRM1.17 V
-
VF (Tvj=25°C typ)1.64 V
-
Voltage Class max650 V
| Recommended | ||
|
OPN
|
FB30R07W2T7PC54BPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY2B | |
| Package Name | N/A | |
| Packing Size | 18 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
CN,DE
|
|
| Country of Diffusion (CoD) |
DE
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY2B |
| Package Name | - |
| Packing Size | 18 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
CN,DE
|
| Country of Diffusion (CoD) |
DE
|
EasyPIM™ 2B 650 V, 30 A module with TRENCHSTOP™ IGBT7, emitter-controlled 7 diode, integrated NTC, and pre-applied Thermal Interface Material.
Features
- TRENCHSTOP™ IGBT7
- EC7 Diode
- pre- applied TIM
- low losses and high efficiency
- Excellent thermal performance
Benefits
- Compact design
- Best cost-performance ratio
- Simplified assembly with pre-applied TIM
- Reduced cooling requirements
Applications
Documents
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