F4-8MXTR23C2M1_H72
NEW
Active and preferred
RoHS Compliant

F4-8MXTR23C2M1_H72

NEW
EasyPACK™ 2C CoolSiC™ MOSFET 2300 V M1H .XT fourpack module

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F4-8MXTR23C2M1_H72
F4-8MXTR23C2M1_H72


Product details

  • Applications
    ESS, EV-Charging, Photovoltaic, SST, DC-DC Converter
  • Configuration
    Fourpack
  • Dimensions (width)
    62.8 mm
  • Dimensions (length)
    57.1 mm
  • Features
    PressFIT
  • Housing
    EasyPACK™ 2C
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    8.3 mΩ

Recommended
OPN
F48MXTR23C2M1H72BPSA1
Product Status active and preferred
Infineon Package AG-EASY2C
Package Name N/A
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY2C
Package Name -
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
EasyPACK™ 2C CoolSiC™ MOSFET M1H fourpack module 2300 V, 17 mΩ with NTC, high current PressFIT and .XT technologies.

Features

  • VDSS = 3300 V
  • IDN = 120 A / IDRM = 300 A
  • Low inductive design
  • Low switching losses
  • High current density
  • Silicon carbide MOSFET with .XT
  • PressFIT contact technology
  • Integrated NTC temperature sensor
  • AlN substrate
  • Package with CTI > 600
  • High current pin
  • High power cycling capability

Benefits

  • Outstanding module efficiency
  • System efficiency improvement
  • Enhanced lifetime
  • High temperature withstand capability
  • Reduction of static losses
  • Compact design
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