Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
CYBLE-214015-01
END OF LIFE
discontinued
RoHS Compliant

CYBLE-214015-01

END OF LIFE
package
board
software

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CYBLE-214015-01
CYBLE-214015-01


Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SAR (1, 12-bit @ 806 ksps)
  • Base Silicon
    PSoC™ 4-BLE
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    1 MByte/s
  • Bluetooth LE RX SENSITIVITY
    -87 dBm
  • Bluetooth LE TX POWER
    3 dBm
  • Bluetooth LE
    Yes
  • CapSense
    Yes
  • CPU Core
    48MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    256 KByte
  • GPIOs
    25
  • I2C
    Configurable
  • Launch Date
    31-03-2015
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M0
  • Operating Temperature range
    -40 °C to 85 °C
  • Operational Amplifier
    Yes
  • Pads
    32
  • PDM
    Configurable
  • Planned to be available until at least
    31-03-2030
  • PWM
    4
  • Secondary CPU Core
    None
  • Serial Communication Blocks
    5
  • Size (X mm x Y mm x Z mm)
    11 x 11 x 1.70 mm
  • SPI
    Configurable
  • SRAM
    32 KByte
  • Type of Antenna
    PCB trace antenna
  • UART
    Configurable
  • V range
    1.9 V to 5.5 V

OPN
CYBLE-214015-01
Product Status discontinued
Infineon Package
LG-MLGA-32
Package Name MODULE-32 (002-15923)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
CN
Country of Diffusion (CoD)
CN,US

Product Status discontinued
Infineon Package
LG-MLGA-32
Package Name MODULE-32 (002-15923)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
CN
Country of Diffusion (CoD)
CN,US
Infineon’s AIROC™ CYBLE-214015-01 is a fully certified Bluetooth® LE embedded module based on Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.1, reducing the additional time needed for design, development and certification. It is available in 11 x 11 x 1.70 mm SMT form-factor, with a PCB trace antenna and is certified to FCC, ISED, MIC, and CE regulations.

Features

  • CAPSENSE™
  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • 18 capacitive sensors
  • PSOC™ 4-BLE Bluetooth® MCU

Benefits

  • Scalable and reconfigurable platform
  • Flexible automatic routing

Applications

Diagrams

CYBLE-214015-01 Block Diagram
CYBLE-214015-01 Block Diagram
CYBLE-214015-01 Block Diagram CYBLE-214015-01 Block Diagram CYBLE-214015-01 Block Diagram
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Documents

Design resources

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