Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued

CY7C1411KV18-300BZC

END OF LIFE
Data Sheet
package

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CY7C1411KV18-300BZC
CY7C1411KV18-300BZC
Data Sheet

Product details

  • Architecture
    QDR-II
  • Bank Switching
    N
  • Burst Length (Words)
    4
  • Data Width
    x 8
  • Density
    36 MBit
  • ECC
    N
  • Family
    QDR-II
  • Frequency
    300 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Pb
  • On-Die Termination
    N
  • Operating Temperature
    0 °C to 70 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Organization (X x Y)
    4Mb x 8
  • Peak Reflow Temp
    220 °C
  • Qualification
    Commercial
  • Read Latency (Cycles)
    1.5
OPN
CY7C1411KV18-300BZC
Product Status discontinued
Infineon Package
P-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 680
Packing Type TRAY
Moisture Level N/A
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant No
Infineon stock last updated:

Product Status discontinued
Infineon Package
P-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 680
Packing Type TRAY
Moisture Level -
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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