Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
CY2309NZSXI-1HT
END OF LIFE
discontinued
RoHS Compliant
Lead-free

CY2309NZSXI-1HT

END OF LIFE
Datasheet
package

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CY2309NZSXI-1HT
CY2309NZSXI-1HT
Datasheet

Product details

  • Category
    Non Zero Delay Buffers
  • Core/IO Operating Voltages ((V))
    3.3
  • Features
    3.3V Non Zero Delay Buffer
  • Function
    See datasheet
  • I/O Voltage ((V))
    3.3
  • Input Frequency range
    0 MHz to 133 MHz
  • Input Type
    LVCMOS/LVTTL
  • Lead Ball Finish
    Pure Sn;Ni/Pd/Au
  • On-chip Clock Generation (PLL)
    0
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    3 V to 3.6 V
  • Output Frequency range
    0 MHz to 133 MHz
  • Output Signal Type
    LVCMOS
  • Outputs
    9
  • Peak Reflow Temp
    260 °C
  • Publish in NPSG
    N
  • Publish in PSG
    Y
  • Qualification
    Industrial
  • Spread Spectrum
    N
OPN
CY2309NZSXI-1HT
Product Status discontinued
Infineon Package
PG-DSO-16
Package Name SOIC-16 (51-85068)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
PG-DSO-16
Package Name SOIC-16 (51-85068)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The CY2309NZSXI-1HT is a nine-output non zero delay buffer for industrial clock distribution, operating from a 3.0 to 3.6 V supply. It supports input and output frequencies up to 133.33 MHz with LVCMOS/LVTTL inputs and LVCMOS outputs. Supply current is under 32 mA at 66.6 MHz, output-output skew is below 250 ps, and it operates from -40 to 85°C. RoHS compliant, in a 16-pin SOIC package.

Features

  • One-input to nine-output buffer
  • Drives up to four SO-DIMMs
  • Low power: <32 mA at 66.6 MHz
  • Supports 2–133.33 MHz frequencies
  • Output-output skew <250 ps
  • Input-output delay 1 ns
  • Multiple VDD/VSS pins for noise/EMI
  • Output rise/fall time ≤1.5 ns
  • Power-up time 0.05–50 ms
  • Thermal resistance 111°C/W (JA)
  • ESD protection >2,000 V

Benefits

  • Enables reliable clock distribution
  • Supports high-density memory systems
  • Extends battery life in mobile devices
  • Flexible for various clock speeds
  • Ensures precise signal timing
  • Fast signal propagation reduces latency
  • Reduces system noise and EMI
  • Fast transitions for sharp signals
  • Quick system power-up
  • Handles thermal stress efficiently
  • Protects against ESD damage

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