PG-TSNP-16-9

Package details

  • Package Material
    PG
  • Package Family
    PG-TSNP
  • Terminals
    16
  • Variant
    9
  • Exposed Paddle
    Yes
  • Body Length (mm)
    2.4
  • Body Width (mm)
    2.4
  • Min. Terminal Pitch (mm)
    0.5
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    3000
    1
    180
Infineon thin small nonleaded packages (TSNP) are offered as different variants. The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Drop-in solutions with identical footprint may be found the package families of land grid array (LGA) or thin small leadless packages (TSLP). Typical products are tuners, RF switches, driver ICs, voltage regulators, amplifiers, surge protection devices, linear voltage regulators, and more.

Documents and drawings

Documents and drawings