PG-TFLGA-39-1

Package details

  • Package Material
    PG
  • Package Family
    PG-TFLGA
  • Terminals
    39
  • Variant
    1
  • Exposed Paddle
    Yes
  • Body Length (mm)
    6.0
  • Body Width (mm)
    7.0
  • Min. Terminal Pitch (mm)
    0.5
  • TRAY
    Pieces/Reel
    Reels/Box
     
    3500
    10
Infineon land grid array packages (LGA) are offered as various families. They are available as thin (T) and ultra thin (U) versions. Fine-pitch variants (F) are specifically designated. The LGA concept utilizes an overmolded laminate substrate to connect on the bottom of the package rather than around its perimeter. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are memories, gate driver ICs, GaN transistors, integrated power stages, switches, and tuners.

Documents and drawings

Documents and drawings