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PG-LQFP-100-29
Package details
-
Package MaterialPG
-
Package FamilyPG-LQFP
-
Terminals100
-
Variant29
-
Exposed PaddleYes
-
Body Length (mm)14.0
-
Body Width (mm)14.0
-
Min. Terminal Pitch (mm)0.5
-
TAPE & REELPieces/BoxTubes/BoxReel diameter (mm)10001330
Infineon quad flat packages (QFP) are offered as various families.
Legacy designations may include TEQFP or PQFP.
The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding.
The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT).
Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.
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Image of the packing type Tray - PG-LQFP-100-29
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