Speech @Embedded World 2026 Nurnberg, March 10th

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Join Manuela Heiss, Head of System Application Engineering MEMS Sensors at Infineon, for her presentation at Embedded World 2026 about the new interface standard SWI3S™ and how it is enabling audio evolution.

The MIPI SWI3S™ standard significantly enhances the performance and integration of XENSIV™  MEMS microphones, by addressing key challenges in audio hardware design. Unlike traditional interfaces, SWI3S™ allows synchronized multichannel audio data, enabling seamless coordination of multiple MEMS microphones for high-performance applications such as ambient AI. This is particularly beneficial for devices requiring precise spatial audio processing, like smart glasses or other compact wearables.

Revolutionize Audio with SWI3S™ and XENSIV™ MEMS Microphones
Webinar on-demand
March 11, 2026
14:00 - 15:00 ( CET )