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Many OEMs are keen to move the SDVs towards “SW-less” edges. Such architectures need different segmentations for I/O aggregation and RCP based nodes (low complexity to high complexity). Existing RCP solutions are really usable only in very specific low complexity nodes (e.g. lighting). This session highlights how Infineon approaches I/O aggregation with various products - especially MCUs configurable firmware provide a far more flexible approach to implement OEM vision of application-SW less edge.

Application and concept engineer

System Architect Communication Technologies

On-demand webinar: How microcontroller based I/O aggregators enable SDVs and a path towards SW-less edge nodes
March 10, 2026
00:00 ( CET )