Register now: December 3rd, 2026 – 2 sessions available 

  • Session 1: December 3rd, 2026, 9 - 10 am CEST
  • Session 2: December 3rd, 2026, 6 - 7 pm CEST

As AI workloads grow more powerful, data centers must deliver far greater computing performance, along with the higher power density and heat that comes with it. Traditional air cooling is reaching its practical limits, making liquid cooling a critical enabler for the next generation of efficient, reliable, and scalable AI infrastructure.

In this webinar, we will examine how the transition from air to liquid cooling is reshaping AI data-center architecture, from direct cooling and coolant distribution units to pumps, fans, chillers, and the power systems that keep them running. We will also explore the broader shift from AC to more efficient DC power distribution and explain how Infineon semiconductors’ solutions help deliver precise control, higher energy efficiency, system readiness, and dependable operation. This session will provide a clear overview of the architecture, technologies, design priorities, and broader considerations shaping this fast-evolving market. Along the way, you will learn where semiconductor solutions create value, how they support system-level requirements, and what to consider when evaluating future-ready liquid-cooling platforms. Join us for an engaging look at how smarter semiconductor technology can help AI data centers manage more power, more heat, and scale with confidence.

  • Why AI data centers need liquid cooling 
  • How liquid cooling reshapes data-center design 
  • How Infineon solutions enable efficient, reliable cooling 
  • Key considerations for selecting semiconductor solutions
  • Liquid cooling as a critical enabler in AI data center’s 
  • Semiconductors’ best fit for your cooling system
  • Use case and design considerations
Muzaffer Albayrak

Senior Application Marketing Manager

Muzaffer Albayrak brings extensive experience in application marketing, business development, and go-to-market strategy within the semiconductor industry. He specializes in energy-efficient power solutions for industrial drives and AI data center infrastructure. In his current role at Infineon Technologies, he is responsible for strategic market development and application marketing for industrial drive solutions, with a particular focus on AI data center cooling. He works closely with customers, partners, and industry stakeholders to accelerate the adoption of innovative power semiconductor technologies that enable high-performance, sustainable, and energy-efficient data centers.

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Stefano Gallinaro

Lead Principal Engineer for System Architecture for AI Data Center Cooling and HVAC

Stefano Gallinaro focuses on system architecture and power electronics for next-generation AI data center cooling and HVAC, developing innovative solutions for efficient and scalable cooling infrastructure. He brings extensive experience in power electronics, motor drives and semiconductor technologies. His background spans application engineering, product and strategic marketing, with expertise in power conversion, renewable energy, EV charging and energy storage.

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Rodrigo Marquina

Global Application Manager for AI Data Center Cooling

Rodrigo brings more than a decade of experience across leading power semiconductor companies and a German automotive OEM. With expertise in Silicon and wide-bandgap technologies, business development and technical marketing, he leads Infineon’s application-level offering and global go-to-market strategy for key applications including AI data center cooling.

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Liquid cooling for AI data centers
More AI, More power, More heat: how semiconductors enable liquid-cooled AI data centers
December 03, 2026
09:00 ( CET )
Online | Live

Check out the other sessions belonging to this series: