SLE 77

Overview

Established powerful 16-bit core and state-of-the-art 90nm technology

One single and unique security microcontroller family the SLE 77 covers the entire SDA, DDA, CDA and dual-interface application spectrum. A common footprint maximizes synergies within the family.

SOLID FLASH™ for record time-to-market
The SLE 77CLFX product group is furthermore the ideal platform for EMV migrations where outstanding contactless performance is required. Particularly, the combination of SOLID FLASH™ and contactless technology makes a perfect match to the market needs with high focus on Java implementations, requiring for shorter development, approval and lead-time cycles.

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Coil on Module packaging innovation

Learn more about the innovative packaging technology from Infineon, which supports fast and easy transition from contact-based to dual-interface cards. Coil on Module was designed to increase the durability and robustness of smart cards. And at the same time, reducing costs for the manufacturer.

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