MEMS Microphones
XENSIV™ MEMS microphones
The popularity of voice user interfaces and the usage of audio recording to share information and experiences are increasing dramatically. However, the performance of microphones often limits the potential of today’s cutting-edge devices. Not anymore!
Infineon XENSIV™ MEMS microphones introduce a new performance class for digital MEMS microphones that overcomes existing audio chain limitations. IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point are required.
Infineon´s Dual Backplate (DBP) MEMS technology
Infineon's dual backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105 dB.
The microphone noise floor is at 25 dB[A] (69 dB[A] SNR) and distortion does not exceed 1 percent even at sound pressure levels of 128 dB SPL (AOP 130 dB SPL). The flat frequency response (28 Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications.
Premium MEMS microphones and cutting-edge audio processing are the key elements for making voice-controlled devices truly ready for everyday situations. Features like turning off a TV across different rooms as well as the ability to whisper to Alexa to dim down the light will be key differentiators of next generation voice-user interfaces. That is why Infineon and its voice-user interface ecosystem partners are leveraging their technological expertise to provide innovative reference platforms and ready-to-use next generation voice-user interface solutions.
Customers looking for a reference design containing Infineon’s XENSIV™ MEMS microphones can contact one of our partners listed below. This section provides an overview and introduction to our partners and their offerings, as well as a relevant distributor or contact person for purchasing support. Kindly refer to the links used in the texts, company logo, and partner signet to navigate directly to the respective website for further information.
| Company | Solution | Description | Details | Purchase |
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VocalFusion stereo-AEC voice processor for Amazon Alexa Voice Service
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This Amazon qualified development kit uses the XMOS stereo-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range. The rich optimisation parameters of the XVF3500 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product. |
Applications: Included IFX product: IM69D130 MEMS mic |
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VocalFusion mono-AEC voice processor for Amazon Alexa Voice Service
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This Amazon qualified development kit uses the XMOS mono-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range. The rich optimisation parameters of the XVF3000 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product. |
Applications: Included IFX product: IM69D130 MEMS mic |
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This integrated audio processing and sound sensing reference platform enables application development and prototyping using real-time, full-speed CEVA-TeakLite-4 DSP silicon combined with the Infineon MEMS microphone IM69D130. The reference platform allows customers to barge into the market quickly with the highest-quality front-end sound processing, lowest power consumption and shortest time to market. |
Applications: Included IFX product: IM69D130 MEMS mic |
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The Amazon qualified Far-Field Voice Solution enables fast path for prototyping and product development of Alexa-enabled devices.
Features include:
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Applications: Included IFX product: IM69D130 MEMS mic |
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The microphone array solution is a software-integrated microphone array for products in the fields of consumer electronics, automotive electronics, and smart home. The array is flexible in configuration, adaptable to multiple scenarios, and support cost controllable. SoundAI’s far field intelligent interactive system SoundAI Azero, can achieve far-field acoustic processing, far-field voice wake-up, far-field voiceprint recognition, far-field speech recognition, far-field duplex call, among other functions. |
Applications: Included IFX product: IM69D130 MEMS mic |
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The Aaware Embedded Voice Platform™ using the signal from our high performance digital XENSIV™ MEMS microphones provides a complete development environment for VUI applications. It captures voice within loud interfering noise, and interfaces to popular wake-word and to automatic speech recognition (ASR) technologies on the edge from key partners such as Picovoice™ and Sensory®. The combination of Aaware voice capture and these partner technologies enables voice controlled digital products with a single-chip solution that are private, secure, reliable and robust as it does not require a cloud infrastructure. The demo of the Aaware Embedded Voice Platform is powered by the Xilinx® Zynq® 7010 All Programmable SoC, enabling DSP and AI acceleration, all within the Avnet® MiniZed™ processing board. |
Applications: Robotics, kiosks, smart speakers, home hubs, automotive Included IFX product: IM69D130 MEMS mic |
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NDP9101 Pi Neural Decision Processor Development System |
The NDP9101 Pi Development System provides a self-contained development system for perceptual audio classification and feature extraction applications including keyword speech (KWS) recognition, wake word processing and speaker identification. The NDP9101 consists of two boards connected together: 2. The Raspberry Pi Model 3B+ is a single-board computer. The Raspberry Pi runs Raspian Linux and the Syntiant NDP10x device control SDK software and allows C and Python interaction with the NDP101 chips. |
Applications: Mobile phones, ear buds and hearing aids, Bluetooth headsets, smart watches, IoT endpoints, remote controls, smart speakers
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Unisound’s solution is a standardized modular communication solution for smart home appliances. Additionally, it provides an all-in-one turnkey solution from voice-user interface (VUI) front-end signal processing to cloud service. Its exclusive Swift AI chip and Infineon's IM69D130 MEMS microphone (linear + ring integrated) can be customized according to customer needs and serves online and offline applications. This solution has 5 major benefits: 1. No need for mobile phones as the user is the control center 2. Natural voice interaction 3. Far-field voice activation and recognition 4. Low power consumption |
Applications: Smart home appliances
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