MEMS Microphones
XENSIV™ - low self-noise (SNR), wide dynamic range, low distortions, high acoustic overload point
The popularity of voice user interfaces and the usage of audio recording to share information and experiences are increasing dramatically. However, the performance of microphones often limits the potential of today’s cutting-edge devices. Not anymore!
Infineon XENSIV™ MEMS microphones introduce a new performance class for digital MEMS microphones that overcomes existing audio chain limitations. IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point are required.
Building upon the superior XENSIVTM MEMS microphone performance, Infineon’s extensive network of global partners offer customers a comprehensive portfolio of XENSIVTM MEMS microphone-based reference designs, as well as Infineon inside MEMS microphones that will propel audio performance to the next level even for the most demanding applications. Click on the buttons below to learn more and purchase our partner solutions.
Infineon´s Dual Backplate (DBP) MEMS technology
Infineon's dual backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105 dB.
The microphone noise floor is at 25 dB[A] (69 dB[A] SNR) and distortion does not exceed 1 percent even at sound pressure levels of 128 dB SPL (AOP 130 dB SPL). The flat frequency response (28 Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications.
Premium MEMS microphones and cutting-edge audio processing are the key elements for making voice-controlled devices truly ready for everyday situations. Features like turning off a TV across different rooms as well as the ability to whisper to Alexa to dim down the light will be key differentiators of next-generation voice-user interfaces. That is why Infineon and its voice-user interface ecosystem partners are leveraging their technological expertise to provide innovative reference platforms and ready-to-use next-generation voice-user interface solutions.
Customers looking for a reference design containing Infineon’s XENSIV™ MEMS microphones can contact one of our partners listed below. This section provides an overview and introduction to our partners and their offerings, as well as a relevant distributor or contact person for purchasing support. Kindly refer to the links used in the texts, company logo, and partner signet to navigate directly to the respective website for further information.
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VocalFusion Dev Kit for Amazon AVS |
The VocalFusion Dev Kit for Amazon AVS (XK-VF3510-L71-AVS) enables developers of smart home products to evaluate and prototype far-field voice interfaces using the XVF3510 voice processor with the Amazon Alexa Voice Service. The VocalFusion XVF3510 enables far-field voice capture with close-range precision. It’s a turnkey solution for developers who want to embed far-field voice control into smart TVs and set-top boxes. XMOS algorithms are purpose-designed to deliver accurate voice capture from across the room, even in noisy environments, and when content is streaming through the device. |
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VocalFusion stereo-AEC voice processor for Amazon Alexa Voice Service
XK-VF3500-L33-AVS Development Kit |
This Amazon qualified development kit uses the XMOS stereo-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range. The rich optimization parameters of the XVF3500 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product. |
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VocalFusion mono-AEC voice processor for Amazon Alexa Voice Service
XK-VF3000-L33-AVS Development Kit |
This Amazon qualified development kit uses the XMOS mono-AEC voice processor, which delivers up-close voice capture quality and processing accuracy at far-field range. The rich optimization parameters of the XVF3000 voice processor enable you to adjust noise attenuation, gain control and residual echo to deliver the best voice capture performance for your product. |
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The Aaware Embedded Voice Platform™ using the signal from our high performance digital XENSIV™ MEMS microphones provides a complete development environment for VUI applications. It captures voice within loud interfering noise, and interfaces to popular wake-word and to automatic speech recognition (ASR) technologies on the edge from key partners such as Picovoice™ and Sensory®. The combination of Aaware voice capture and these partner technologies enables voice controlled digital products with a single-chip solution that are private, secure, reliable and robust as it does not require a cloud infrastructure. The demo of the Aaware Embedded Voice Platform is powered by the Xilinx® Zynq® 7010 All Programmable SoC, enabling DSP and AI acceleration, all within the Avnet® MiniZed™ processing board. |
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This integrated audio processing and sound sensing reference platform enables application development and prototyping using real-time, full-speed CEVA DSP silicon combined with the Infineon MEMS microphone IM69D130. The reference platform allows customers to barge into the market quickly with the highest-quality front-end sound processing, lowest power consumption and shortest time to market. |
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The Amazon qualified Far-Field Voice Solution enables fast path for prototyping and product development of Alexa-enabled devices.
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This is a VUI turnkey solution (module/algorithm/software), including AI noise reduction, echo cancellation and voice activation algorithms.
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ENS-2 module is a noise reduction module specially developed for communication devices, which enables users to have a noise-free conversation. With the robust and powerful deep learning-based algorithms, ENS-2 can effectively separate speech from background environmental noises and deliver unparalleled speech quality through an incredibly small form factor solution.
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The Edge Voice Solution is an off-line voice wake-up module, which uses Infineon’s IM69D130 MEMS mic. Aside from being highly flexible and low power (<1mA), this solution offers voice identification in multi-speaker scenario. Similarly, thanks to its sophisticated AI capabilities, customers can tailor the device to respond only to certain people. Key features: 2. Biometrics: enables IoT devices with voice print |
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Sugr Sense VUI Downlight Solution is an Amazon Alexa Voice Service (AVS)-certified voice-user interface turnkey solution (module, algorithm, and software). It supports Alexa Call & Message (ACM), Multi-room Music (MRM), and can pick-up far field voice up to 10 meters in a quiet home environment. Additional features include: 1. Supports multiple languages, such as Mandarin, English, etc. 2. Ready to integrate in multiple processing (e.g., ARM) & ASR platforms (e.g., Tencent) 3. Voice-user interface front-end hardware design (software/algorithm) 4. SoC control platform & system design |
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The NDP9101 development platform contains the NDP101 along with components required to prototype applications such as keyword spotting, wake word processing and speaker identification consuming only 140µW. The Syntiant® NDP100™ ultra low-power Neural Decision Processor™ can support local voice commands, as shown in this video along with Infineon XENSIV™ MEMS microphones and also comes with the Amazon Alexa Voice Service keyword model which enables a close talk built-in Alexa experience. The NDP9101 consists of two boards connected together: 1. The NDP9101 board contains the NDP101 device along with power circuitry, audio microphones, clock generation, Flash Memory, & ARM Debug port. 2. The Raspberry Pi Model 3B+ is a single-board computer. The Raspberry Pi runs Raspian Linux and the Syntiant NDP10x device control SDK software and allows C and Python interaction with the NDP101 chips. |
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Unisound’s solution is a standardized modular communication solution for smart home appliances. Additionally, it provides an all-in-one turnkey solution from voice-user interface (VUI) front-end signal processing to cloud service. Its exclusive Swift AI chip and Infineon's IM69D130 MEMS microphone (linear + ring integrated) can be customized according to customer needs and serves online and offline applications. This solution has 5 major benefits: 1. No need for mobile phones as the user is the control center 2. Natural voice interaction 3. Far-field voice activation and recognition 4. Low power consumption |
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