SECORA™ Pay security solutions
SECORA™ Pay security solutions is offering a streamlined migration path to the EMV standard
SECORA™ Pay is based on our unique SOLID FLASH™ microcontroller family providing outstanding contactless transaction speeds and superior performance for today’s single- and multi-application projects. This family offers a complete portfolio supporting everything from contact cards to smart payment accessories.
Furthermore, our innovative Coil on Module (CoM) chip package increases production efficiency and general robustness of dual-interface cards. At the same time, the very small antenna design supports novel contactless payment factors such as smart watches with payment functionality.
- Secured, fast, flexible payments
- Open standards including the interoperability standard EMVCo and the non-proprietary, open ticketing standard CIPURSE™
- Dual-interface functionality, contact-based and contactless transactions
- Static, dynamic and combined data authentication schemes (SDA, DDA, CDA)
- Innovative technologies like CoM and SOLID FLASH™
- Greater power efficiency
The SECORA™ Pay portfolio comprises the Pay S, Pay X and Pay W variants.
SECORA™ Pay S is a ready-to-use, optimized solution for standard Visa (VSDC) and MasterCard (M/Chip) payment cards.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | 16 KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval
Flip chip packages for robust contact card production
*Pure contactless and other packaging options on request |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing |
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| Available and certified Infineon reference EMV applets |
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SECORA™ Pay X is a flexible enablement platform, giving customers the flexibility they need to address EMV-based payment schemes and deliver local content (to prepare for CPA, for instance). It comes with ready-to-use reference solutions for Visa, MasterCard and CIPURSE™ – the open standard for secured and cost-effective handling of payment, access and ticketing applications.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | Up to 190 KB SOLID FLASH™ NVM as platform-only configuration without any reference applets (Pay X) |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork- based scheme approval
Flip chip packages for robust contact card production
*Pure contactless and other packaging options on request |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing |
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| Available and certified Infineon reference EMV applets |
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| Other optional applications |
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SECORA™ Pay W is a ready-to-use and optimized chip solution portfolio for smart accessories with standard Visa (VSDC) and MasterCard (M/Chip) functionality.
| Operating System | Java Card 3.0.4, GlobalPlatform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 Type A, T=0 |
| Memory for user applets and user data | 16 KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Dual-interface package options |
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| Wire antenna design | • SPA: antenna design included in delivery package • MCC8: antenna design will be tailored to customer needs |
| Available and certified Infineon reference EMV applets |
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| Other optional applications |
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