Active and preferred
RoHS Compliant

ISG0613N04NM6HSC

OptiMOS™ 5 dual N-channel 60 V MOSFETs in scalable power block with dual-side cooling capability
Data Sheet
package
ea.
in stock

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ISG0613N04NM6HSC
ISG0613N04NM6HSC
ea.
Data Sheet

Product details

  • Budgetary Price €/1k
    1.72
  • ID (@25°C) max
    299 A
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    Power Block 6.3x6
  • Polarity
    N
  • QG (typ @10V)
    69 nC
  • RDS (on) (@10V) max
    0.88 mΩ
  • Special Features
    Symmetrical Half-bridge
  • VDS max
    40 V
  • VGS(th)
    2.3 V
Recommended
OPN
ISG0613N04NM6HSCATMA1
Product Status active and preferred
Infineon Package
PG-WHITFN-10
Package Name PQFN 6.3x6
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-WHITFN-10
Package Name PQFN 6.3x6
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Dual N-channel MOSFETs in PQFN 6.3x6.0 features low RDS(on) of 0.88 mΩ each with Q1/Q2 in a half-bridge configuration. This can replace two discrete Q1/Q2 MOSFETs ex: PQFN 5x6 and shrink the power section on the board by at least 50%. The low parasitic inductance of the package improves switching performance & EMI while reducing overall BOM cost. The dual-side cooling capability boosts power throughput by an additional 25% with superior thermal management.

Features

  • Cutting edge OptiMOS™ silicon technology
  • Outstanding FOMs
  • High chip/package ratio
  • Optimized lead-frame and Cu-clip design
  • Internally connected Q1/Q2 MOSFETs
  • Compact and simplified layout design
  • Dual-side cooling

Benefits

  • Minimized conduction losses
  • Reduced voltage overshoot
  • High power capability
  • Superior thermal performance
  • Lowest loop inductance
  • Superior switching performance/EMI
  • Superior thermal management

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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