Active
RoHS Compliant

IRF5305S

IR MOSFET -55 V in a D²PAK package
Data Sheet
package
Multiple OPNs available
ea.

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

IRF5305S
IRF5305S
ea.
Data Sheet

Product details

  • Budgetary Price €/1k
    0.46
  • ID (@25°C) max
    -31 A
  • Moisture Sensitivity Level
    1
  • Mounting
    SMD
  • Package
    D2PAK (TO-263)
  • Polarity
    P
  • Ptot max
    110 W
  • Qgd
    19.3 nC
  • QG (typ @10V)
    42 nC
  • RDS (on) (@10V) max
    60 mΩ
  • RthJC max
    1.4 K/W
  • Tj max
    175 °C
  • VDS max
    -55 V
  • VGS(th)
    -3 V
  • VGS max
    20 V
Recommended
OPN
IRF5305STRLPBF IRF5305STRRPBF
Product Status active obsolete
Infineon Package
D2PAK
D2PAK
Package Name D2PAK D2PAK
Packing Size 800 800
Packing Type TAPE & REEL LEFT TAPE & REEL RIGHT
Moisture Level 1 1
Moisture Packing NON DRY NON DRY
Lead-free No No
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:
 ea. in stock ea. in stock

Product Status
Active
Infineon Package
D2PAK
Package Name D2PAK
Packing Size 800
Packing Type TAPE & REEL LEFT
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status obsolete
Infineon Package
D2PAK
Package Name D2PAK
Packing Size 800
Packing Type TAPE & REEL RIGHT
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS , lighting , load switches as well as battery powered applications.

Benefits

  • Planar cell structure for wide SOA
  • Optimized for broadest availability from distribution partners
  • Product qualification according to JEDEC standard
  • Silicon optimized for applications switching below <100 kHz
  • Industry standard surface-mount power package
  • High-current carrying capability package (up to 195 A, die-size dependent)
  • Capable of being wave-soldered

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }