Active and preferred
RoHS Compliant

FF1300UXTR23T2M1P

CoolSiC™ MOSFET half-bridge module 2300 V

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FF1300UXTR23T2M1P
FF1300UXTR23T2M1P

Product details

  • Applications
    Renewables, ESS, H2, Traction
  • Configuration
    Half-bridge
  • Dimensions (length)
    140 mm
  • Dimensions (width)
    100 mm
  • Features
    .XT interconnection technology, TIM
  • Housing
    XHP™ 2
  • Qualification
    Traction, Industrial
  • RDS (on) (@ Tj = 25°C)
    1.27 mΩ
OPN
FF1300UXTR23T2M1PBPSA1
Product Status active and preferred
Infineon Package AG-XHP2K23
Package Name N/A
Packing Size 4
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-XHP2K23
Package Name -
Packing Size 4
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
XHP™ 2 CoolSiC™ MOSFET 2300 V, 1.3 mΩ module with half-bridge topology, robust .XT interconnection technology for enhanced lifetime with best in class reliability and with pre-applied Thermal Interface Material (TIM).

Features

  • Integrated body diode
  • 1500 A Inom
  • Low-inductive housing XHP™ 2
  • .XT interconnection technology
  • Symmetrical module design
  • Lowest switching and conduction losses
  • Tvj,op=175°C continuous
  • 4 kV isolation voltage
  • Cu baseplate

Benefits

  • Energy efficiency
  • High power density
  • Extended lifetime
  • Best in class reliability

Documents

Design resources

Developer community

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