Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
CYBT-223058-02
END OF LIFE
discontinued
RoHS Compliant

CYBT-223058-02

END OF LIFE
Datasheet
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CYBT-223058-02
CYBT-223058-02
Datasheet


Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SD(1,12-bit ENoB (audio), 10-bit ENoB (DC), 12MHz clock)
  • Base Silicon
    CYW20819
  • Bluetooth Classic
    Yes
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    -93.5dBm
  • Bluetooth EDR 2Mbps TX POWER
    0 dBm
  • Bluetooth LE Data rate
    2 MByte/s
  • Bluetooth LE RX SENSITIVITY
    - 95.0 dBm
  • Bluetooth LE TX POWER
    4 dBm
  • Bluetooth LE
    Yes
  • CapSense
    No
  • CPU Core
    96MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    256 KByte
  • GPIOs
    22
  • I2C
    1
  • Launch Date
    31-03-2018
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M4
  • Operating Temperature range
    -30 °C to 85 °C
  • Operational Amplifier
    No
  • Pads
    35
  • PDM
    1
  • Planned to be available until at least
    31-03-2033
  • PWM
    6
  • ROM
    1MB
  • Secondary CPU Core
    None
  • Serial Communication Blocks
    0
  • Size (X mm x Y mm x Z mm)
    11 x 11 x 1.70 mm
  • SPI
    2
  • SRAM
    176 KByte
  • Type of Antenna
    Chip Antenna
  • UART
    2
  • V range
    1.71 V to 3.3 V

OPN
CYBT-223058-02
Product Status discontinued
Infineon Package
LG-MLGA-35
Package Name MODULE-35 (002-29172)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
CN
Country of Diffusion (CoD)
TW

Product Status discontinued
Infineon Package
LG-MLGA-35
Package Name MODULE-35 (002-29172)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
CN
Country of Diffusion (CoD)
TW
Infineon’s AIROC™ CYBT-223058-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 11x11x1.7mm SMT form-factor. Infineon’s AIROC™ CYBT-223058-02 module complies with Bluetooth® Core 5.4 and have gone through Qualification with Required Testing path with Declaration ID D052875 and QDID 158813.

Features

  • Onboard crystal oscillator
  • Passive components
  • 256KB onboard flash memory
  • CYW20819 system on chip
  • Globally certified

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications

Applications

Diagrams

CYBT-223058-02 Block Diagram
CYBT-223058-02 Block Diagram
CYBT-223058-02 Block Diagram CYBT-223058-02 Block Diagram CYBT-223058-02 Block Diagram
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