Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued
RoHS Compliant

AIGB15N65F5

END OF LIFE
World-class low-cost power for fast-switching applications in small SMD packages
Data Sheet
package

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AIGB15N65F5
AIGB15N65F5
Data Sheet

Product details

  • IC (@ 100°) max
    15 A
  • IC (@ 25°) max
    30 A
  • Launch year
    2020
  • Package
    D2PAK (TO-263-3)
  • Reflow Solderable
    Yes
  • Switching Frequency
    15-120 kHz
  • Technology
    IGBT TRENCHSTOP™ 5
  • Type
    IGBT
  • VCE(sat)
    1.6 V
  • VCE max
    650 V
  • Voltage Class max
    650 V
OPN
AIGB15N65F5ATMA1
Product Status discontinued
Infineon Package
PG-TO263-3
Package Name D2PAK (TO-263-3)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
PG-TO263-3
Package Name D2PAK (TO-263-3)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon's 650V TRENCHSTOP™ 5 AUTO technology with H5/F5 optimization enhances energy efficiency in fast-switching automotive applications, offering world's lowest losses for increased cruising range or downsizing of batteries in electric vehicles and reducing fuel consumption in hybrid vehicles. Additionally, its SMD housing reduces costs and improves quality control.

Features

  • TRENCHSTOP™ 5 technology with low VCEsat, optimized as F5 variant (Highest Efficiency Variant) for highest possible switching speed
  • 650V break-down voltage, 15A nominal current
  • Very fast switching (up to 150kHz)
  • Automotive qualified in accordance to Infineon quality standards
  • Max junction temperature 175 °C
  • Highest efficiency
  • very low conduction losses
  • very low switching losses
  • Very low junction and case temperature
  • SMD D2PAK package for low assembly costs and higher power density
  • Extremely robust

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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